Nisshinbo Industries, Inc.

Other

Nisshinbo Chemical Inc.

Norimasa Nakamura

Hideshi Tomita

Yasuo Imashiro

Takahiko Ito

Ikuo Takahashi

Satoshi Amano

Hirotaka Iida

Tsuyoshi Takeuchi

Tomoki Nakamura

Yoshihiro Yamazaki

Takahiko Itoh

Ayumi Horiuchi

Shoji Kuroyama

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).

One-pack type adhesive and fuel cell separator

A carbodiimide composition having an improved heat resistance which meets conventional requirements for a carbodiimide compound to be compounded in an ester-group-containing resin or a biodegradable plastic, and exhibiting no coloring problems due to yellowing, and having a superior stabilizing effect agains hydrolysis. The carbodiimide composition comprises a carbodiimide compound (A) and an antioxidant (B), having a 5% weight loss temperature not lower than 250&#xb0; C. as determined by a thermogravimetric (TG) method, wherein an antioxidant (B) is dispersed and present in the composition by admixing during synthesis of a carbodiimide compound (A), a stabilizer against hydrolysis mainly comprising the carbodiimide composition and a thermoplastic resin composition containing the same.

Carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition

A biodegradable plastic composition which can be stably adjusted in biodegradation rate, and has greatly improved resistance to hydrolysis and weather, in particular the former, and durability resulting from the improved resistances; a molded article thereof; and a method for controlling biodegradation rate using the same composition. The biodegradable plastic composition comprising (A) 100 parts by weight of biodegradable plastic, (B) 0.01 to 10 parts by weight of a carbodiimide compound and (C) 0.01 to 10 parts by weight of at least one compound selected from the group consisting of benzotriazole-, triazine- and hydroxylamine-based compounds; the molded article thereof; and the method for controlling biodegradation rate using the same composition.

Aliphatic polyester composition, a molded article thereof and a method for controlling biodegradation rate using the same composition

A biodegradable plastic composition enabling to stably adjust biodegradation rate, improve hydrolysis resistance and heat resistance, and retain transparency, molded articles thereof and a method for controlling biodegradation rate of the biodegradable plastic. In more detail, a biodegradable plastic composition, characterized in that said composition is made by compounding 100 parts by weight of a biodegradable plastic (A), in particular, an aliphatic type polyester with 0.01 to 5 parts by weight of a carbodiimide compound (B) and 0.01 to 3 parts by weight of an antioxidant (C), in particular, a hindered phenol type antioxidant with a molecular weight of not less than 400 alone or mixed antioxidants of said hindered phenol type antioxidant and a phosphite type antioxidant, a molded article thereof and a method for controlling biodegradation rate of the biodegradable plastic.

Biodegradable plastic composition, a molded article thereof and a method for controlling biodegradation rate

Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition

Resin-coated metal foil

The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Adhesive film for semiconductor package

A metal material subjected to a treatment for seizure prevention is provided. The metal material includes a metal base material and a film formed thereon, the film being composed of a carbodiimide group-containing resin obtained from an aromatic polyisocyanate or of a mixture of said carbodiimide group-containing resin and a lubricant. A method for producing a metal material subjected to a treatment for seizure prevention is also provided. The method includes coating, on a metal base material, a carbodiimide group-containing resin obtained from an aromatic polyisocyanate or a mixture of said carbodiimide group-containing resin and a lubricant, and then subjecting the coated metal base material to a heat treatment at a temperature of 120&deg; C. or higher.

Metal material subjected to treatment for seizure prevention and method for production thereof

The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.

Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board

A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.

LCP bonding method

The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.

Film-shaped encapsulating agent for electronic parts

The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

One-pack type epoxy resin composition

Epoxy resin composition

There are provided a polycarbodiimide copolymer having a main structure represented by the following formula (1): ##STR1## wherein R.sub.1 is an isocyanate residue; R.sub.2 is a polyfunctional liquid rubber residue; X is a urethane bond, an amide bond or a urea bond; p is an integer of 5 to 50; q is an integer of 1 to 5; and r is 0 or 1; and a process for producing the above polycarbodiimide copolymer, which comprises reacting a polyfunctional liquid rubber with an organic diisocyanate in excess of the rubber and then subjecting the diisocyanate components in the reaction system to carbodiimization using a carbodiimidization catalyst. The polycarbodiimide copolymer alleviates the problems of the prior art, has the excellent heat resistance inherently possessed by polycarbodiimide resins, is improved, as compared with conventional polycarbodiimide resins, in thermoformability under heating and pressure when made into a solid such as a powder or granules, and causes no blistering under heating.

Polycarbodiimide copolymer and process for production thereof

A process for producing a polycarbodiimide resin powder, which includes reacting an organic diisocyanate in the presence of a carbodiimidization catalyst in a solvent to produce a polycarbodiimide resin and obtaining the resin in a powder form, where the organic diisocyanate is represented by the following formula ##STR1## where R.sub.1 is a lower alkyl group or a lower alkoxyl group, or ##STR2## where R.sub.2 and R.sub.3 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group, and X is an oxygen atom or a methylene group, or ##STR3## where R.sub.4 and R.sub.5 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group; the solvent is a mixed solvent of a good solvent to polycarbodiimide resin and a poor solvent to the resin, having a precipitation number of 30-80; and when the reaction has reached a certain stage, the reaction system is cooled to make the system a slurry of a polycarbodiimide, and then the polycarbodiimide is obtained in a powder form.

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Chiba, Japan

Norimasa Nakamura