The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2000

Filed:

Mar. 16, 1999
Applicant:
Inventors:

Satoshi Amano, Tokyo, JP;

Norimasa Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08L / ;
U.S. Cl.
CPC ...
528170 ; 528 44 ; 528 48 ; 528 51 ; 528 67 ; 528310 ; 528322 ; 524710 ; 524872 ; 524873 ;
Abstract

There are provided a polycarbodiimide copolymer having a main structure represented by the following formula (1): ##STR1## wherein R.sub.1 is an isocyanate residue; R.sub.2 is a polyfunctional liquid rubber residue; X is a urethane bond, an amide bond or a urea bond; p is an integer of 5 to 50; q is an integer of 1 to 5; and r is 0 or 1; and a process for producing the above polycarbodiimide copolymer, which comprises reacting a polyfunctional liquid rubber with an organic diisocyanate in excess of the rubber and then subjecting the diisocyanate components in the reaction system to carbodiimization using a carbodiimidization catalyst. The polycarbodiimide copolymer alleviates the problems of the prior art, has the excellent heat resistance inherently possessed by polycarbodiimide resins, is improved, as compared with conventional polycarbodiimide resins, in thermoformability under heating and pressure when made into a solid such as a powder or granules, and causes no blistering under heating.


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