Kumamoto, Japan

Norifumi Kohama

USPTO Granted Patents = 5 

Average Co-Inventor Count = 2.2

ph-index = 1


Location History:

  • Kumamoto, JP (2021 - 2023)
  • Koshi, JP (2022 - 2023)

Company Filing History:


Years Active: 2021-2025

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5 patents (USPTO):Explore Patents

Title: Norifumi Kohama: Innovator in Substrate Processing Technologies

Introduction

Norifumi Kohama is a prominent inventor based in Kumamoto, Japan. He has made significant contributions to the field of substrate processing, holding a total of 5 patents. His innovative work focuses on enhancing the efficiency and effectiveness of substrate processing methods and devices.

Latest Patents

Kohama's latest patents include a substrate processing method, modification device, and substrate processing system. The substrate processing method involves forming a modification layer on the rear surface of a substrate by radiating a laser beam. This method allows for the processing of the front surface of the substrate while the rear surface is held in place. Additionally, his modification device is designed to create this modification layer using a laser irradiation unit. Another notable patent is the parameter adjustment method for a bonding apparatus, which includes processes for acquiring inspection results and changing parameters based on distortion trends in combined substrates.

Career Highlights

Norifumi Kohama is currently employed at Tokyo Electron Limited, a leading company in the semiconductor and electronics manufacturing industry. His work at this organization has allowed him to develop and refine his innovative technologies, contributing to advancements in substrate processing.

Collaborations

Kohama has collaborated with notable coworkers such as Kimio Motoda and Norio Wada. Their combined expertise has fostered a productive environment for innovation and development in their field.

Conclusion

Norifumi Kohama's contributions to substrate processing technologies highlight his role as a key innovator in the industry. His patents and collaborative efforts continue to influence advancements in this critical area of technology.

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