The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
May. 29, 2019
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Norifumi Kohama, Koshi, JP;
Takayuki Ishii, Koshi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B23K 26/324 (2014.01); B23K 26/53 (2014.01); H01L 21/263 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B23K 26/324 (2013.01); B23K 26/53 (2015.10); H01L 21/263 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/68764 (2013.01); B23K 2103/56 (2018.08);
Abstract
A substrate processing method of processing a substrate includes: forming a modification layer at least on a surface layer of a rear surface of the substrate or within the substrate by radiating a laser beam; and processing a front surface of the substrate in a state that the rear surface of the substrate is held. A modification device includes a laser irradiation unit configured to form a modification layer at least on a surface layer of the rear surface of the substrate or within the substrate by radiating a laser beam.