Nobuaki Ohki

Title: Nobuaki Ohki: Innovator in Multilayer Printed Circuit Board Technology

Introduction

Nobuaki Ohki is a prominent inventor based in Hadano, Japan. He has made significant contributions to the field of printed circuit board technology, holding a total of 2 patents. His work focuses on enhancing the design and manufacturing processes of multilayer printed circuit boards.

Latest Patents

Ohki's latest patents include a multilayer printed circuit board and a method of producing the same. The multilayer printed circuit board features multiple printed circuit boards, each equipped with electric source or ground layers and signal circuit layers on opposite surfaces. These boards are stacked using adhesive layers, allowing for an alternating arrangement of electric source or ground layers and signal circuit layers. This innovative design optimizes the characteristic impedance of each signal circuit layer based on the thickness and material of the substrate and adhesive sheets used.

Additionally, he has developed a method for fabricating multilayer printed-circuit boards. This method involves stacking a variety of internal layer sheets in an alternating arrangement, laminated together with adhesive material sheets interposed between them. By melting the adhesive sheets, the internal layer sheets are effectively laminated, resulting in a multilayer printed-circuit composite that minimizes dimensional changes and achieves a compact overall thickness.

Career Highlights

Nobuaki Ohki is currently employed at Hitachi, Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in advancing the technology behind multilayer printed circuit boards, which are essential components in modern electronic devices.

Collaborations

Ohki has collaborated with notable colleagues, including Norio Sengoku and Fumiyuki Kobayashi. Their combined expertise has contributed to the successful development of advanced technologies in the field.

Conclusion

Nobuaki Ohki's contributions to multilayer printed circuit board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing. His work continues to influence the industry and pave the way for future advancements.