The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1986
Filed:
Dec. 21, 1984
Hitachi, Ltd., Tokyo, JP;
Abstract
A method of fabricating a multilayer printed-circuit composite in which a plurality of internal layer sheets are stacked in an alternate arrangement with one another and laminated together. The relatively thin and thick internal layer sheets are stacked alternately with adhesive material sheets being interposed between the adjacent internal layer sheets. By melting the adhesive material sheets, the stacked internal layer sheets are laminated together. This structure of the multilayer printed-circuit board is effective for reducing the dimensional changes of the internal layer sheet when compared with the structure composed only of thin internal layer sheets. Thus, the multilayer printed-circuit composite can be realized in a relatively small overall thickness while reducing the dimensional changes of the individual internal layer sheets.