The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 1989

Filed:

Apr. 14, 1983
Applicant:
Inventors:

Nobuaki Ohki, Hadano, JP;

Norio Sengoku, Hadano, JP;

Fumiyuki Kobayashi, Sagamihara, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361414 ;
Abstract

A multilayer printed circuit board having a plurality of printed circuit boards each having opposite surfaces respectively provided with an electric source or ground layer and a signal circuit layer. The plurality of printed circuit boards is stacked through adhesive layers such that the electric source or ground layer and the signal circuit layer are alternately disposed, the characteristic impedance of each signal circuit layer is given by a thickness and material of each of the substrate and the adhesive sheet disposed between the signal circuit layer and one of two electric source or ground layers adjacent to the signal circuit layer and between the same signal circuit layer and the other electric source or ground layer.


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