Nirmal K Sharma

Title: Nirmal K Sharma: Innovator in Integrated Circuit Technology

Introduction

Nirmal K Sharma is a notable inventor based in Fremont, CA, with a focus on enhancing integrated circuit technology. He holds 4 patents that reflect his innovative contributions to the field. His work primarily revolves around improving thermal performance in integrated circuit packages.

Latest Patents

One of Nirmal's latest patents is titled "Package for Integrated Circuit with Thermal Vias and Method Thereof." This invention presents a method for enhancing the thermal performance of an integrated circuit package by attaching a dummy die to the semiconductor die. The dummy die is thermally coupled through external terminals to the conductive layers of a printed circuit board. The integrated circuit package includes an insulating substrate on which the dummy die is attached. Conductive vias thermally connect conductive terminals on one side of the insulating substrate to those on the opposite side. This package can be provided as a ball grid array (BGA) package, and it allows for multiple layers of conductors in both the insulating substrate and the external printed circuit board.

Career Highlights

Nirmal has worked with prominent companies in the technology sector, including Intersil Corporation and ST Assembly Test Services Inc. His experience in these organizations has contributed significantly to his expertise in integrated circuit design and thermal management.

Collaborations

Throughout his career, Nirmal has collaborated with talented professionals such as Rahamat Bidin and Hien Boon Tan. These collaborations have fostered innovation and development in his projects.

Conclusion

Nirmal K Sharma's contributions to integrated circuit technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods for enhancing thermal performance continue to impact the industry positively.