This inventor holds 7 USPTO granted patents and 1 EPO patent. Top assignee: Infineon Technologies Ag. Active years: 2013-2020.
Location History:
- Möhnesee, DE (2014)
- Moehnesee, DE (2013 - 2020)
Company Filing History:
Years Active: 2013-2020
Title: Niels Oeschler: Innovator in Semiconductor Processing
Introduction
Niels Oeschler is a prominent inventor based in Moehnesee, Germany. He has made significant contributions to the field of semiconductor processing, holding a total of 7 patents. His innovative approaches have paved the way for advancements in substrate bending techniques.
Latest Patents
Oeschler's latest patents include an "Apparatus and method for bending a substrate." This method involves placing a substrate on a first curved surface of a bending tool and using a second bending tool to apply pressure, effectively bending the substrate. Another notable patent is the "Apparatus and method for processing a semiconductor substrate," which follows a similar process tailored specifically for semiconductor materials.
Career Highlights
Niels Oeschler is currently employed at Infineon Technologies AG, where he continues to develop cutting-edge technologies in semiconductor processing. His work has been instrumental in enhancing the efficiency and effectiveness of substrate bending methods.
Collaborations
Throughout his career, Oeschler has collaborated with talented professionals such as Kirill Trunov and Roland Speckels. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Niels Oeschler's contributions to the field of semiconductor processing through his patents and collaborations highlight his role as a key innovator. His work continues to influence the industry and drive advancements in technology.