The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jun. 28, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andre Wedi, Soest, DE;
Guido Boenig, Warstein, DE;
Niels Oeschler, Moehnesee, DE;
Christian Stahlhut, Rinteln, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4878 (2013.01); H01L 23/3735 (2013.01); H01L 23/492 (2013.01); H01L 24/75 (2013.01); H01L 2224/79315 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A method includes placing a semiconductor substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the semiconductor substrate, thereby pressing the semiconductor substrate onto the first curved surface and bending the semiconductor substrate, and removing the bended semiconductor substrate from the first bending tool.