Nicolas Sunderland

Title: Innovations of Nicolas Sunderland

Introduction

Nicolas Sunderland is an accomplished inventor based in Venetia, PA (US). He holds a total of 3 patents that showcase his expertise in electronic components and thermal management solutions. His innovative approach has led to significant advancements in the field of electronics.

Latest Patents

One of Nicolas Sunderland's notable inventions is the in-mold electronic printed circuit board encapsulation and assembly. This invention provides an assembly that includes a thermally conductive thermoplastic polymer, which acts as a heat sink for effective thermal management of electrical and electronic components. Additionally, it utilizes a reaction injection molded (RIM) polyurethane to replace the traditional potting compound used in such assemblies. This innovation not only replaces the potting compound but also forms the part, such as the base of an LED bulb, which has previously been a separate component. This advancement reduces the number of components required and saves a production step, streamlining the manufacturing process.

Career Highlights

Throughout his career, Nicolas has worked with reputable companies such as Covestro LLC and Thermal Solution Resources, LLC. His experience in these organizations has contributed to his development as a leading inventor in his field.

Collaborations

Nicolas has collaborated with talented individuals, including Terry G Davis and David Rocco, who have contributed to his projects and innovations.

Conclusion

Nicolas Sunderland's contributions to the field of electronics through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the industry and pave the way for future developments.