The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Apr. 16, 2014
Applicants:

Covestro Llc, Pittsburgh, PA (US);

Thermal Solution Resources, Llc, Narragansett, RI (US);

Inventors:

Terry G. Davis, Kimball, MI (US);

David Rocco, Bridgeville, PA (US);

Mikhail Sagal, Wakefield, RI (US);

Jessee McCanna, Midland, PA (US);

Nicolas Sunderland, Venetia, PA (US);

James Lorenzo, Mars, PA (US);

Mark Matsco, Monaca, PA (US);

Kevin Dunay, Bethel Park, PA (US);

Assignees:

COVESTRO LLC, Pittsburgh, PA (US);

THERMAL SOLUTION RESOURCES, LLC, Warwick, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/87 (2015.01); F21K 9/23 (2016.01); B29C 67/24 (2006.01); F21K 99/00 (2016.01); F21K 9/90 (2016.01); F21V 23/00 (2015.01); F21V 29/77 (2015.01); B29K 75/00 (2006.01); B29K 669/00 (2006.01); B29L 31/34 (2006.01); F21V 31/04 (2006.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/87 (2015.01); B29C 67/246 (2013.01); F21K 9/23 (2016.08); F21K 9/90 (2013.01); F21V 23/006 (2013.01); F21V 29/773 (2015.01); B29K 2075/00 (2013.01); B29K 2669/00 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/3425 (2013.01); F21V 31/04 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08);
Abstract

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.


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