Company Filing History:
4 out of 228 
2 out of 5 Years Active: 2018-2021
Title: Jessee McCanna: Innovator in Electronic Component Encapsulation
Introduction
Jessee McCanna is a notable inventor based in Midland, PA (US). She has made significant contributions to the field of electronic component encapsulation, holding a total of 4 patents. Her innovative work focuses on improving the efficiency and effectiveness of electronic assemblies.
Latest Patents
One of her latest patents is titled "In mold electronic printed circuit board encapsulation and assembly." This invention provides an assembly that includes a thermally conductive thermoplastic polymer as a heat sink, which enhances thermal management for electrical and electronic components. Additionally, it utilizes a reaction injection molded (RIM) polyurethane to replace the traditional potting compound, thereby reducing the number of components and saving a production step.
Another significant patent is "Processes for In-Mold coating systems for molding, and products formed therefrom." This patent discloses processes for In-Mold coating of a substrate, which involves introducing a curable composition to a mixhead at an elevated pressure. The process includes mixing polymeric components to form a coating composition that is then introduced into a mold containing a substrate, resulting in a curable coating on the substrate's surface.
Career Highlights
Jessee has worked with several prominent companies, including Covestro LLC and Thermal Solution Resources, LLC. Her experience in these organizations has allowed her to develop and refine her innovative ideas in electronic component encapsulation.
Collaborations
Throughout her career, Jessee has collaborated with talented individuals such as Terry G Davis and David Rocco. These collaborations have contributed to her success and the advancement of her inventions.
Conclusion
Jessee McCanna is a pioneering inventor whose work in electronic component encapsulation has led to significant advancements in the field. Her innovative patents and career achievements reflect her dedication to improving technology and efficiency in electronic assemblies.