Covestro LLC

Thermal Solution Resources, LLC

Jessee McCanna

Kurt E Best

James Lorenzo

Mark Matsco

David Rocco

Robert A Wade

Terry G Davis

Nicolas Sunderland

Mikhail Sagal

Kevin Dunay

Timothy Bish

James Robbins

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

In mold electronic printed circuit board encapsulation and assembly

Disclosed are processes for In-Mold coating of a substrate. The processes include: introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.

Processes for In-Mold coating systems for molding, and products formed therefrom

Disclosed are processes for in-mold coating of a plastic substrate. The processes include: (a) molding a plastic substrate in a first mold cavity of a mold comprising at least two cavities to form a molded plastic substrate; (b) introducing the molded plastic substrate into a second mold cavity of the mold; (c) introducing a coating composition into the second mold cavity containing the molded plastic substrate in order to coat the substrate, the coating composition comprising: (i) a polymer comprising isocyanate-reactive groups; and (ii) a polyisocyanate; (d) curing the composition in the second mold cavity; and (e) opening the mold cavity.

Processes for in-mold coating using a multi-cavity mold and substrates coated thereby

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Midland, PA, United States of America

Jessee McCanna