Covestro LLC

Thermal Solution Resources, LLC

Bayer Materialscience, LLC

Covestro Deutschland Ag

Nicolas Sunderland

James P Mason

James Lorenzo

Mark Matsco

Terry G Davis

Mikhail Sagal

Kevin Dunay

Marina Rogunova

Berit Krauter

David Rocco

Jessee McCanna

Hans Franssen

Gerald A Dibattista

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

In mold electronic printed circuit board encapsulation and assembly

A flame-retardant, optically clear thermoplastic molding composition is disclosed. The composition contains aromatic polycarbonate resin, a bromine-substituted carbonate oligomer, a phosphorous containing compound and an inorganic salt of perfluoroalkane sulfonic acid in amounts effective to impart to the composition flame resistance that in accordance with UL-94-5V standard is rated A at 3.00 mm and V-0 at 1.5 mm.

Flame retardant, optically clear thermoplastic molding composition

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Venetia, PA, United States of America

Nicolas Sunderland