Cremlingen, Germany

Nicolas Heuck

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014-2021

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations of Nicolas Heuck

Introduction

Nicolas Heuck is a notable inventor based in Cremlingen, Germany. He has made significant contributions to the field of engineering, particularly in the area of joining technologies. With a total of 4 patents to his name, Heuck's work has advanced the methods used in producing integral joins and connecting mediums.

Latest Patents

Heuck's latest patents include a method for producing an integral join and an automatic placement machine. This innovative method involves a powder carrier that receives a layer of metal powder through an automatic feed. A first joining partner is pressed onto this powder layer, bonding a portion of it to the partner. The process allows for the first joining partner to be lifted along with the bonded powder layer, which is then positioned between two joining partners. A sintered join is created by pressing these partners together, ensuring that the powder layer portion contacts both. Additionally, Heuck has developed methods for producing a connecting medium on an assembly partner and for creating material-fit connections between assembly partners and metal layers.

Career Highlights

Nicolas Heuck is currently employed at Infineon Technologies AG, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of joining processes in various applications.

Collaborations

Heuck collaborates with talented coworkers such as Roland Speckels and Marco Marchitto, contributing to a dynamic and innovative work environment.

Conclusion

Nicolas Heuck's contributions to the field of engineering through his patents and collaborative efforts highlight his role as a significant inventor. His innovative methods for producing integral joins and connecting mediums are paving the way for advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…