The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Jan. 29, 2016
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Nicolas Heuck, Cremlingen, DE;

Marco Marchitto, Bad Sassendorf, DE;

Roland Speckels, Kamen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); B23K 1/00 (2006.01); B23K 1/018 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); B23K 1/0016 (2013.01); B23K 1/018 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/3006 (2013.01); H01L 23/3735 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 24/29 (2013.01); H01L 24/743 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/27442 (2013.01); H01L 2224/27831 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29373 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/743 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83207 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A method for producing a layer including a connecting medium on an assembly partner is provided. The method includes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.


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