The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

May. 27, 2016
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Nicolas Heuck, Cremlingen, DE;

Marco Marchitto, Bad Sassendorf, DE;

Roland Speckels, Kamen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B32B 5/16 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B22F 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 7/064 (2013.01); B32B 5/16 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); B32B 2250/03 (2013.01); B32B 2264/105 (2013.01); B32B 2310/028 (2013.01); B32B 2311/12 (2013.01); B32B 2311/24 (2013.01); B32B 2315/02 (2013.01); B32B 2457/14 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75281 (2013.01); H01L 2224/75282 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75349 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01);
Abstract

A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.


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