Taipei, Taiwan

Nick Yang

This inventor holds 2 USPTO granted patents. Top assignees: Triallian Corporation, Other. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nick Yang. Retrieved from https://idiyas.com/inventor/nick-yang-ilw03lyf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:

goldMedal2 out of 3 
 
Triallian Corporation
 patents
silverMedal2 out of 834,601 
Other
 patents
where one patent can have more than one assignee

Years Active: 2019-2023

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Nick Yang

Introduction

Nick Yang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of printed circuit board (PCB) technology. With a total of 2 patents, Yang's work focuses on optimizing manufacturing processes for PCBs.

Latest Patents

Yang's latest patents include a method for optimized filling holes and manufacturing fine lines on printed circuit boards. This innovative method separates the processes of filling holes and creating fine lines. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. This approach ensures that the copper-plating fillings are evenly compact and that the fine lines have square profiles.

Another notable patent is a method for manufacturing traces of PCBs. This method employs a periodic pulse reverse (PPR) pattern plating process. In the first stage, the walls and bottoms of drilled holes in the PCB are modified with rGO, allowing for the formation of vias filled with copper. A very thin copper layer is then formed on the substrate through electroplating. In the second stage, a pattern of very fine traces with a width/space of less than 30/30 µm is created on the thin copper layer. After removing the unwanted copper layer, the traces achieve even thicknesses and square profiles, meeting the requirements of high-density interconnection (HDI) technology.

Career Highlights

Throughout his career, Nick Yang has worked with various companies, including Triallian Corporation. His expertise in PCB technology has positioned him as a valuable asset in the industry.

Collaborations

Yang has collaborated with notable individuals, including his coworker Albert Yeh. Their combined efforts have contributed to advancements in PCB manufacturing techniques.

Conclusion

Nick Yang's innovative patents and career achievements highlight his significant impact on the field of printed circuit board technology. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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