The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Jul. 15, 2021
Applicants:
Triallian Corporation, New Taipei, TW;
Albert Yeh, New Taipei, TW;
Inventors:
Albert Yeh, New Taipei, TW;
Nick Yang, New Taipei, TW;
Assignees:
TRIALLIAN CORPORATION, New Taipei, TW;
Other;
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); H05K 3/42 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); C25D 5/18 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01); C25D 5/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/423 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 5/18 (2013.01); C25D 5/56 (2013.01); C25D 7/00 (2013.01); H05K 3/0047 (2013.01); H05K 3/188 (2013.01);
Abstract
A method for optimized filling holes and manufacturing fine lines on a printed circuit board (PCB) carries out the two processes separately. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. The processes are individually performed and thus operating parameters are considered independently. As a result, the copper-plating fillings are evenly compact and the fine lines have square profiles.