IDiyas

For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Nicholas Holmberg

USPTO Granted Patents = 14

Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 312(Granted Patents)


Company Filing History:

goldMedal13 out of 54,664 
 
Intel Corporation
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 2003-2015

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14 patents (USPTO):Explore Patents
1. 9177911 - Package substrates with multiple dice (2015-11-03),
2. 8742597 - Package substrates with multiple dice (2014-06-03),
3. 7505248 - Controlled-resistance capacitors, and methods of assembling same (2009-03-17),
4. 7495336 - Array capacitors for broadband decoupling applications (2009-02-24),
5. 7463492 - Array capacitors with voids to enable a full-grid socket (2008-12-09),
6. 7365428 - Array capacitor with resistive structure (2008-04-29),
7. 7355836 - Array capacitor for decoupling multiple voltage rails (2008-04-08),
8. 7265995 - Array capacitors with voids to enable a full-grid socket (2007-09-04),
9. 7215530 - High ESR low ESL capacitor (2007-05-08),
10. 7179093 - Retractable ledge socket (2007-02-20),
11. 7173804 - Array capacitor with IC contacts and applications (2007-02-06),
12. 7081650 - Interposer with signal and power supply through vias (2006-07-25),
13. 6819543 - Multilayer capacitor with multiple plates per layer (2004-11-16),
14. 6606237 - Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same (2003-08-12),

Title: A Profile of Inventor Nicholas Holmberg

Introduction

Nicholas Holmberg is an innovative inventor based in Gilbert, AZ. With an impressive portfolio of 14 patents, Holmberg has made significant contributions to the field of package substrates, showcasing his expertise and creativity in advanced materials and engineering.

Latest Patents

Holmberg's latest patents focus on package substrates with multiple embedded dice. His notable work includes a design where each of the embedded dice can be connected directly to a bus of the package substrate without the need for routing through another die. This groundbreaking approach can be configured as a bumpless build-up layer (BBUL) substrate, enhancing performance and efficiency in electronic applications. This innovation not only simplifies the architecture of electronic devices but also contributes to the miniaturization of components.

Career Highlights

Throughout his career, Nicholas has worked with renowned companies, most notably at Intel Corporation. His experience in a leading tech giant has provided him with a solid foundation in cutting-edge technologies and methods, allowing him to adopt an innovative mindset in his projects.

Collaborations

Nicholas has collaborated with several talented individuals in the tech industry, including coworkers Dustin P. Wood and Kaladhar Radhakrishnan. Together, they have pushed the boundaries of technology and explored new avenues in product development.

Conclusion

Nicholas Holmberg stands out as a talented inventor whose work in package substrates continues to influence the evolution of electronic devices. His contributions reflect a dedication to innovation and advancement, ensuring his position as a key figure in his field. As he continues to develop new ideas and patents, the technology community eagerly anticipates his future endeavors.

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