Hsinchu, Taiwan

Ni-Hwi Kuan

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ni-Hwi Kuan. Retrieved from https://idiyas.com/inventor/ni-hwi-kuan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Ni-Hwi Kuan

Introduction

Ni-Hwi Kuan, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the fields of microelectromechanical systems (MEMS) technology. His work particularly focuses on enhancing manufacturing processes, making them more efficient and reliable.

Latest Patents

Kuan holds a patent for a groundbreaking method titled "Method to Avoid Amorphous-Si Damage During Wet Stripping Processes in the Manufacture of MEMS Devices." This innovative technique involves utilizing an amorphous silicon layer as a release layer. The process includes etching superjacent films while employing the amorphous silicon layer as an etch stop layer. Notably, this layer proves resistant to damage during solvent stripping operations, thanks to the oxidation of its exposed portions using oxygen plasma.

Career Highlights

Currently, Ni-Hwi Kuan is associated with Taiwan Semiconductor Manufacturing Company Ltd., a leader in the semiconductor industry. His work at TSMC reflects his commitment to advancing technology and improving manufacturing processes in the competitive landscape of semiconductor manufacturing.

Collaborations

Kuan collaborates with esteemed colleagues such as Fei-Yun Chen and Yuh-Hwa Chang. These partnerships in research and development foster a creative environment that leads to innovative solutions in MEMS technology.

Conclusion

In conclusion, Ni-Hwi Kuan represents a remarkable example of how innovation can transform industries. His patented method showcases the potential of advanced technologies to enhance manufacturing processes. With a strong foundation in collaboration and a focus on improving efficiency, Kuan continues to be a pivotal figure in the ongoing evolution of MEMS devices and semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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