Hong Kong, China

Neil Robert McLellen


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 185(Granted Patents)


Company Filing History:


Years Active: 2004-2006

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2 patents (USPTO):Explore Patents

Title: Neil Robert McLellen: Innovator in Integrated Circuit Technology

Introduction

Neil Robert McLellen is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit technology, holding 2 patents that showcase his innovative approach to enhancing thermal dissipation in electronic devices.

Latest Patents

McLellen's latest patents include a method of manufacturing an enhanced thermal dissipation integrated circuit package. This invention involves a detailed process of installing a carrier onto a substrate, attaching a semiconductor die, and aligning an assembly that includes a heat sink and a thermally conductive element. The method ensures that the thermally conductive element does not directly contact the semiconductor die, allowing for effective heat management. His other patent focuses on an integrated circuit package that features a semiconductor die connected to a substrate, a heat sink with an extending finger, and a thermally conductive element that is strategically placed to optimize thermal performance.

Career Highlights

Neil Robert McLellen is currently associated with A-sat Corporation, where he continues to push the boundaries of technology in integrated circuits. His work has been instrumental in developing solutions that address the challenges of thermal management in electronic devices.

Collaborations

Throughout his career, McLellen has collaborated with notable professionals in the field, including Edward G Combs and Robert P Sheppard. These collaborations have further enriched his innovative endeavors and contributed to the advancement of integrated circuit technology.

Conclusion

Neil Robert McLellen stands out as a key figure in the realm of integrated circuit innovation. His patents reflect a commitment to improving thermal dissipation methods, which are crucial for the performance and reliability of electronic devices. His contributions continue to influence the industry and inspire future innovations.

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