The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Jul. 11, 2001
Edward G. Combs, Foster, CA (US);
Robert P. Sheppard, Red Bluff, CA (US);
Tai Wai Pun, Tin Shui Wai, HK;
Hau Wan Ng, Tuen Mun, HK;
Chun Ho Fan, Sham Tseng, HK;
Neil Robert McLellen, Mid Levels, HK;
ASAT Limited, Tsuen Wan, HK;
Abstract
In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the heat sink further including an extending finger when viewed from a top of the package, the extending finger including the side portion of the heat sink, a thermally conductive element thermally coupled with an interposed between both the semiconductor die and the heat sink, wherein the thermally conductive element does not directly contact the semiconductor die, and an encapsulant material encapsulating the thermally conductive element and the heat sink such that the top portion and the side portion of the heat sink are exposed to the surroundings of the package.