Hau Wan Ng

Title: Hau Wan Ng: Innovator in Integrated Circuit Technology

Introduction

Hau Wan Ng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique patent that enhances thermal dissipation in integrated circuit packages.

Latest Patents

Hau Wan Ng holds a patent for an "Enhanced thermal dissipation integrated circuit package." This invention relates to an integrated circuit package that includes a semiconductor die electrically connected to a substrate. The design features a heat sink with a top and side portion, which includes an extending finger when viewed from the top of the package. A thermally conductive element is thermally coupled and interposed between both the semiconductor die and the heat sink, ensuring that the thermally conductive element does not directly contact the semiconductor die. An encapsulant material encapsulates the thermally conductive element and the heat sink, allowing the top and side portions of the heat sink to be exposed to the surroundings of the package.

Career Highlights

Hau Wan Ng is associated with A-sat Corporation, where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing thermal management solutions in electronic devices.

Collaborations

Hau Wan Ng has collaborated with notable colleagues, including Edward G Combs and Robert P Sheppard. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Hau Wan Ng is a distinguished inventor whose work in integrated circuit technology has made a significant impact. His patent for enhanced thermal dissipation showcases his innovative spirit and dedication to advancing technology.