The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Mar. 18, 2004
Edward G. Combs, Foster, CA (US);
Robert P. Sheppard, Red Bluff, CA (US);
Tai Wai Pun, Tin Shui Wai, HK;
Hau Wang NG, Tuen Mun, HK;
Chun Ho Fan, Sham Tseng, HK;
Neil Robert Mclellen, Mid Levels, HK;
Edward G. Combs, Foster, CA (US);
Robert P. Sheppard, Red Bluff, CA (US);
Tai Wai Pun, Tin Shui Wai, HK;
Hau Wang Ng, Tuen Mun, HK;
Chun Ho Fan, Sham Tseng, HK;
Neil Robert McLellen, Mid Levels, HK;
ASAT Limited, Hong Kong, HK;
Abstract
In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.