Sedgefield, United Kingdom

Neil Davies

This inventor holds 8 USPTO granted patents and 4 EPO patents. Top assignees: Pragmatic Printing Limited, Pragmatic Semiconductor Limited. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Neil Davies. Retrieved from https://idiyas.com/inventor/neil-davies-1jy1qbix

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 87.5

 

Average Co-Inventor Count = 3.9

ph-index = 1


Location History:

  • Herts, GB (2020)
  • Sedgefield, GB (2021 - 2024)

Company Filing History:


Years Active: 2020-2026

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8 patents (USPTO):Explore Patents

Title: Inventor Neil Davies: Pioneering Innovations in Flexible Electronics

Introduction

Neil Davies, an accomplished inventor based in Sedgefield, Great Britain, has made significant contributions to the field of electronics with a total of six patents to his name. His inventive work primarily focuses on flexible electronic systems that enhance functionality and efficiency in various applications.

Latest Patents

Davies's latest patents include a groundbreaking "Flexible Interposer" and an innovative "Integrated Circuit on Flexible Substrate Manufacturing Process." The Flexible Interposer relates to an interposer subassembly designed for electronic systems featuring at least one integrated circuit (IC) component. This invention incorporates a flexible base layer with a first surface and an opposing second surface, integrates at least one active electronic circuit component within the base layer, and includes a patterned contact layer to facilitate connection with the IC component.

The Integrated Circuit on Flexible Substrate Manufacturing Process introduces advanced techniques for producing multiple discrete integrated circuits on a carrier. This process involves providing a carrier for a flexible substrate, depositing a uniform thickness of the substrate, and strategically removing portions to create channels that enhance the spacing between the IC substrate units.

Career Highlights

Throughout his career, Neil Davies has contributed his expertise to companies such as Pragmatic Printing Limited and Pragmatic Semiconductor Limited. His innovative work has not only advanced flexible electronics but also positioned these companies as leaders in their respective fields of printed and semiconductor technologies.

Collaborations

Davies has collaborated with notable coworkers, including Stephen Devenport and Richard John Price. These partnerships have been instrumental in driving forward the development of advanced electronic systems and enhancing research initiatives within the industry.

Conclusion

Neil Davies's contributions to the field of flexible electronics exemplify the spirit of innovation and the quest for improved technologies in today's rapidly evolving landscape. With six patents to his name, his work continues to inspire future inventors and shape the future of electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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