The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jan. 30, 2019
Applicant:

Pragmatic Printing Ltd., Sedgefield, GB;

Inventors:

Richard Price, Sedgefield, GB;

Brian Cobb, Sedgefield, GB;

Neil Davies, Sedgefield, GB;

Assignee:

PRAGMATIC PRINTING LTD., Sedgefield, GB;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1262 (2013.01); H01L 21/78 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01);
Abstract

The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.


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