The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Feb. 09, 2017
Applicant:

Pragmatic Printing Ltd., Sedgefield Durham, GB;

Inventors:

Neil Davies, Herts, GB;

Richard David Price, Manchester, GB;

Stephen Devenport, Gateshead, GB;

Stuart Philip Speakman, Essex, GB;

Assignee:

PRAGMATIC PRINTING LTD., Sedgefield Durham, GB;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/133 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75601 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/95115 (2013.01); H01L 2224/97 (2013.01);
Abstract

A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.


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