Neil C Delaplane

Title: Neil C. Delaplane: Innovator in Network Communication Technology

Introduction

Neil C. Delaplane is a notable inventor based in Tualatin, Oregon. He has made significant contributions to the field of network communication technology, holding a total of 3 patents. His work focuses on reducing electromagnetic interference and emissions, which is crucial for the advancement of electronic devices.

Latest Patents

Among his latest patents is a device designed for network communication housing. This invention features a substrate that effectively reduces electromagnetic interference. The substrate includes multiple ground layers, signal layers, and power layers, with ground rings extending around the perimeter of each layer. These ground rings are interconnected through ground stitching or vias, which are randomly spaced based on the operating frequencies of integrated circuit devices mounted on the substrate. Additionally, a cover assembly made of conductive material can be coupled to the exposed ground rings, providing further shielding and creating a virtual electrical ground cage that minimizes electromagnetic emissions.

Career Highlights

Neil C. Delaplane is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Neil has collaborated with esteemed colleagues such as Ravi V. Mahajan and Harry G. Skinner. These collaborations have fostered an environment of innovation and have led to the development of advanced technologies in the field.

Conclusion

Neil C. Delaplane's contributions to network communication technology exemplify the importance of innovation in reducing electromagnetic interference and emissions. His patents and work at Intel Corporation highlight his role as a key figure in advancing electronic device technology.