Intel Corporation

Neil C Delaplane

Ravi V Mahajan

Harry G Skinner

Hong Xie

Robert Starkston

Shawn McEuen

Gregory Alan James

Mirng-Ji Lii

Gary L Bookhardt

Josh Gordon

Marc A Abrams

Ron Edsall

Robert L Van Egmond

Brad T Combs

Ryan Wilday

Network communication housing

A substrate for reducing electromagnetic emissions is provided. The substrate may include a plurality of ground layers, signal layers and power layers. All of the layers other than the ground layer are provided with a ground ring that may extend around the perimeter of the layer. The ground rings are electrically coupled together by ground stitching or vias that are randomly spaced. The random spacing of the ground stitching is based on the operating frequencies of the integrated circuit devices mounted on the substrate. Additional shielding may be provided by providing a cover assembly made of any conductive material that is coupled to the exposed ground rings on the uppermost and lowermost surfaces of the substrate. The cover assembly is coupled to the exposed ground rings in a randomized pattern. The device provides a virtual electrical ground cage in which the internal signal layers are totally enclosed, thereby reducing electromagnetic emissions.

Substrate for reducing electromagnetic interference and enclosure

An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.

Cartridge and an enclosure for a semiconductor package

Growing community of inventors

Tualatin, OR, United States of America

Neil C Delaplane