Kuna, ID, United States of America

Neal Bowen

This inventor holds 4 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2006-2017.


% Patents Active = 100.0

Average Co-Inventor Count = 1.2

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2006-2017

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Neal Bowen

Introduction

Neal Bowen is a notable inventor based in Kuna, Idaho, recognized for his significant contributions to the field of semiconductor technology. With a total of 4 patents to his name, Bowen has developed innovative methods and systems that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Bowen's latest patents include groundbreaking methods for temporarily bonding a device wafer to a carrier wafer. This method involves the use of two different adhesives with varying glass transition temperatures, allowing for effective bonding of the device wafer to the carrier wafer. Additionally, he has developed a two-die semiconductor assembly that features a planar lead frame, which includes a die paddle and multiple lead fingers. This assembly is designed to secure semiconductor dies and facilitate their integration into electronic systems.

Career Highlights

Neal Bowen is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to focus on advancing semiconductor technologies and contributing to the company's innovative projects.

Collaborations

Throughout his career, Bowen has collaborated with talented individuals such as Sharon N Farrens and Andrew M Bayless. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Neal Bowen's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods and systems continue to shape the future of semiconductor applications.

Profile summary based on public USPTO records.
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