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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9716023 B1

PDFFull Text
Date of Patent:
Jul. 25, 2017

Filed:

Jul. 15, 2014

Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Sharon N. Farrens, Boise, ID (US);

Neal Bowen, Kuna, ID (US);

Andrew M. Bayless, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

TraskBritt

Primary Examiner:

Philip Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
B29C 53/82 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 7/14 (2006.01); C09J 5/04 (2006.01); H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/683 (2006.01); B32B 37/12 (2006.01); B32B 5/14 (2006.01); B32B 7/12 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 5/142 (2013.01); B32B 37/1292 (2013.01); B32B 7/12 (2013.01); B32B 38/105 (2013.01); B32B 2250/02 (2013.01); B32B 2255/00 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, disposing a second adhesive over a peripheral portion of the carrier wafer, the second adhesive having a second glass transition temperature greater than the first glass transition temperature, and bonding the first adhesive to an active front side of the device wafer and the second adhesive to a peripheral portion of the front side of the device wafer. Related assemblies may be used in such methods.

Find Patent Forward Citations

Farrens, Sharon. (2017). Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies (U.S. Patent No. 9716023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9716023

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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