Naweed Anjum

Title: Naweed Anjum: Innovator in Electronic Device Packaging

Introduction

Naweed Anjum is a prominent inventor based in Murphy, TX (US), known for his contributions to electronic device packaging. With a total of 6 patents to his name, Anjum has made significant strides in enhancing the reliability and functionality of electronic devices.

Latest Patents

Among his latest patents, Anjum has developed an "Electronic device package with board level reliability." This innovative method involves providing a product package for a product die, building a product mimic die that mimics the product die, and packaging it for reliability testing. The process includes revising the product package based on testing results until it meets reliability standards. Another notable patent is the "Electronic device with crack arrest structure," which features a multilayer lead frame and a conductive crack arrest structure designed to enhance the durability of packaged electronic devices.

Career Highlights

Anjum is currently employed at Texas Instruments Corporation, where he continues to push the boundaries of electronic device technology. His work focuses on improving the reliability and performance of electronic components, making them more efficient and durable.

Collaborations

Throughout his career, Anjum has collaborated with talented individuals such as Michael G Amaro and Charles Allen DeVries, contributing to a dynamic and innovative work environment.

Conclusion

Naweed Anjum's contributions to the field of electronic device packaging have established him as a key figure in innovation. His patents reflect a commitment to enhancing the reliability and functionality of electronic devices, making a lasting impact in the industry.