This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Resonac Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Naomitsu Komori: Innovator in Photosensitive Resin Technology
Introduction
Naomitsu Komori is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of photosensitive resin compositions, which play a crucial role in the production of printed wiring boards. His innovative work has led to the development of advanced materials that enhance the efficiency and reliability of electronic devices.
Latest Patents
Naomitsu Komori holds a patent for a photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring boards. The patent describes a photosensitive resin composition that includes a photopolymerizable compound with an ethylenically unsaturated group and an acid substituent, a curing agent, a photopolymerization initiator, and a polyfunctional monomer. This innovative composition is designed to improve the production process and performance of printed wiring boards.
Career Highlights
Komori is currently associated with Resonac Corporation, where he continues to advance his research and development efforts. His work has significantly impacted the electronics industry, particularly in the area of printed circuit board manufacturing. With a focus on innovation, he has contributed to the creation of materials that meet the evolving demands of technology.
Collaborations
Throughout his career, Naomitsu Komori has collaborated with notable colleagues, including Shuji Nomoto and Akihiro Nakamura. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the pursuit of groundbreaking advancements in materials science.
Conclusion
Naomitsu Komori's contributions to the field of photosensitive resin technology exemplify the spirit of innovation. His patented work continues to influence the electronics industry, paving the way for future advancements in printed wiring board production.