The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Jun. 18, 2020
Showa Denko Materials Co., Ltd., Tokyo, JP;
Naomitsu Komori, Tokyo, JP;
Shuji Nomoto, Tokyo, JP;
Akihiro Nakamura, Tokyo, JP;
Hayato Sawamoto, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.