Tokyo, Japan

Naoki Yokoyama


 

Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 22(Granted Patents)


Location History:

  • Fukuoka, JP (1992)
  • Nakano-ku, JP (2004)
  • Sodegaura, JP (2011 - 2019)
  • Tokyo, JP (2005 - 2023)

Company Filing History:


Years Active: 1992-2023

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10 patents (USPTO):Explore Patents

Title: Naoki Yokoyama: Innovator in Epoxy Resin Technology

Introduction

Naoki Yokoyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of epoxy resin technology, holding a total of 10 patents. His work focuses on enhancing the properties and applications of epoxy resins, particularly through innovative modifications.

Latest Patents

Yokoyama's latest patents include advancements in epoxy resin modified with polyurethane in low concentration. One of his notable inventions is a polyurethane-modified epoxy resin that exhibits favorable processing operability in casting and impregnation. This invention includes a production method for creating a low-concentration polyurethane-modified epoxy resin, which incorporates a secondary hydroxyl group-containing bisphenol-based epoxy resin. The composition is designed to optimize the use of epoxy resin while ensuring effective processing capabilities.

Career Highlights

Throughout his career, Naoki Yokoyama has worked with reputable companies such as Nippon Steel Chemical & Material Co., Ltd. and Hitachi Kokusai Electric Inc. His experience in these organizations has allowed him to refine his expertise in resin technology and contribute to various innovative projects.

Collaborations

Yokoyama has collaborated with notable colleagues, including Tomonori Akai and Eisuke Yamada. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the field of epoxy resins.

Conclusion

Naoki Yokoyama's contributions to epoxy resin technology highlight his innovative spirit and dedication to advancing material science. His patents reflect a commitment to improving processing operability and functionality in resin applications.

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