Nippon Steel Chemical & Material Co., Ltd.

Dai Nippon Printing Co., Ltd.

Hitachi-kokusai Electric Inc.

Nippon Steel Chemical Co., Ltd.

Naoki Yokoyama

Tomonori Akai

Yuichi Taniguchi

Koichi Hattori

Kyohei Kano

Yuya Takasugi

Kazuo Ishihara

Tetsuya Nakanishi

Eisuke Yamada

Tohru Kunitake

Provided is a polyurethane-modified epoxy resin having favorable processing operability in casting, impregnation, or the like in a composition state, a method for producing the same, and a composition of the same. Provided is a low-concentration polyurethane-modified epoxy resin including: a polyurethane having a secondary hydroxyl group-containing bisphenol-based epoxy resin that has an epoxy equivalent of 150 to 200 g/eq and a hydroxyl equivalent of 2,000 to 2,600 g/eq, added to both terminals and/or a single terminal thereof, in which the polyurethane is a modified product of the epoxy resin that is modified with a middle- and high-molecular-weight polyol compound having an Mn of 200 or larger, a polyisocyanate compound, and a low-molecular-weight polyol compound as a chain extender having an Mn of less than 200, and the epoxy resin is used in an amount of 68 to 92 weight % based on a total amount of the components.

Epoxy resin modified with polyurethane in low concentration, production method therefor, epoxy resin composition, and cured object

Provided is a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state. The epoxy resin composition includes, as essential components, the following components (A) to (D): (A) a low-concentration polyurethane-modified epoxy resin containing a polyurethane having an epoxy resin added to each of both terminals thereof and/or one terminal thereof; (B) a polyurethane-unmodified epoxy resin that is liquid at 30&#xb0; C.; (C) a solid epoxy resin having a bisphenol structure, the resin having a glass transition temperature or a melting point of 50&#xb0; C. or more; and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof, wherein the epoxy resin composition includes the component (A) at from 3.0 wt % to 30.0 wt %, and the component (C) at from 0.1 wt % to 40.0 wt % with respect to the total of the components (A) to (D).

Epoxy resin composition and cured product

Provided is a resin composition to be suitably used as the matrix resin of a fiber-reinforced composite material excellent in fatigue resistance. In the resin composition for a fiber-reinforced composite material, 50 mass % or more of an epoxy resin (A) includes a phenol novolac-type epoxy resin containing a compound represented by the following general formula (1) and a compound represented by the following general formula (2), and in gel permeation chromatography measurement, the phenol novolac-type epoxy resin contains a body corresponding to m=0 at a ratio of 75% by area or more and a body corresponding to m=1 at a ratio of 6% by area or less.

Curable epoxy resin composition, and fiber-reinforced composite material obtained using same

Provided are a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state, a production method therefor, and a composition thereof. The polyurethane-modified epoxy resin is obtained by modifying a secondary hydroxyl group-containing bisphenol-based epoxy resin (a) having an epoxy equivalent from 150 g/eq to 200 g/eq and a hydroxyl equivalent from 2,000 g/eq to 2,600 g/eq with a polyol compound (b) having an Mn of 200 or more, a polyisocyanate compound (c), and a polyol compound (d) having an Mn of less than 200 serving as a chain extender. The polyurethane-modified epoxy resin uses the epoxy resin (a) in an amount from 20 wt % to 60 wt % with respect to the total amount of the respective components (a), (b), (c), and (d), and contains a polyurethane having the epoxy resin (a) added to both terminals thereof and/or one terminal thereof.

Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product

This invention provides a means for cell migration assays by regulating the cells adhered to a substrate so that they migrate to a given region, which is a substrate used for cell culture comprising: a base material comprising a conductive region and an insulating region provided thereon and cell-adhesive regions and non-cell-adhesive regions provided in the conductive region and the insulating region, respectively, wherein a cell-adhesive region is positioned adjacent to a non-cell-adhesive region in the conductive region, and a cell-adhesive region is positioned adjacent to a non-cell-adhesive region in the insulating region.

Substrate used for cell migration assays and method for cell migration assays

This invention provides a means for modifying surface properties of a cell culture substrate under specific conditions, to thereby regulate regions to which cells are allowed to adhere or are not allowed to adhere, depending on cell type. This invention relates to a method of cell culture comprising steps of: applying a positive potential to a conductive region of a substrate comprising a base material having a conductive region and a non-cell-adhesive membrane coupled thereto with the aid of silane, so as to separate the non-cell-adhesive membrane from the substrate; and culturing cells in a region from which the non-cell-adhesive membrane has been separated.

Method of cell culture

A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.

Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition

A subscriber wireless access system equipped with customer stations wirelessly connected to base stations and accommodating communication terminal devices in the customer stations. The system is provided with at least one exchange for connecting the base stations with a virtual dedicated line network for enabling customer stations wirelessly connected to different base stations to be interconnected via a virtual dedicated line network. The exchange includes table information assigned to the customer stations with virtual network connection information allocated for connected the customer stations, means responsive to receipt of data from a customer station via a subordinate base station for, with reference to the table, sending the data through the virtual network to another base station, and means responsive to receipt of data through the virtual network for, with reference to the table, converting the data to customer station identification information and sending the data to a subordinate base station.

Subscriber wireless access system

There is disclosed a wireless access system in which subscriber registration, deletion, and the like are set in a pertinent wireless base station in accordance with a request from a management center, and remote maintenance is realized. The management center is provided with an SNMP manager, each wireless base station is provided with an SNMP agent, and an SNMP protocol is used to set information of subscriber new registration, registration deletion, operation stop, and operation restart in a subscriber management information table for use in communication permission in accordance with SET request in the wireless access system.

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Tokyo, Japan

Naoki Yokoyama