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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10266637 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Jun. 02, 2015

Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product

Applicant:

Nippon Steel & Sumikin Chemical Co., Ltd., Tokyo, JP;

Inventors:

Eisuke Yamada, Toyota, JP;

Naoki Yokoyama, Sodegaura, JP;

Tohru Kunitake, Tokyo, JP;

Assignee:

NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 18/58 (2006.01); C08G 59/14 (2006.01); C08G 59/22 (2006.01); C08G 18/12 (2006.01); C08G 18/76 (2006.01); C08G 59/42 (2006.01); C08L 63/00 (2006.01); C08L 75/08 (2006.01); C08G 18/48 (2006.01); C08G 18/64 (2006.01); C08G 59/40 (2006.01); C08G 59/20 (2006.01); C08G 18/66 (2006.01); C08G 18/40 (2006.01);
U.S. Cl.
CPC ...
C08G 18/58 (2013.01); C08G 18/12 (2013.01); C08G 18/4081 (2013.01); C08G 18/4825 (2013.01); C08G 18/6407 (2013.01); C08G 18/6674 (2013.01); C08G 18/7671 (2013.01); C08G 59/14 (2013.01); C08G 59/20 (2013.01); C08G 59/4028 (2013.01); C08G 59/4238 (2013.01); C08L 63/00 (2013.01); C08L 75/08 (2013.01); C08G 59/1433 (2013.01); C08G 59/1477 (2013.01);
Abstract

Provided are a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state, a production method therefor, and a composition thereof. The polyurethane-modified epoxy resin is obtained by modifying a secondary hydroxyl group-containing bisphenol-based epoxy resin (a) having an epoxy equivalent from 150 g/eq to 200 g/eq and a hydroxyl equivalent from 2,000 g/eq to 2,600 g/eq with a polyol compound (b) having an Mn of 200 or more, a polyisocyanate compound (c), and a polyol compound (d) having an Mn of less than 200 serving as a chain extender. The polyurethane-modified epoxy resin uses the epoxy resin (a) in an amount from 20 wt % to 60 wt % with respect to the total amount of the respective components (a), (b), (c), and (d), and contains a polyurethane having the epoxy resin (a) added to both terminals thereof and/or one terminal thereof.

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