Company Filing History:
Years Active: 2000-2009
Title: Naoki Ohmiya: Innovator in Wafer Technology
Introduction
Naoki Ohmiya is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer technology, holding a total of 8 patents. His innovative work focuses on methods and apparatuses that enhance the efficiency and effectiveness of wafer processing.
Latest Patents
Ohmiya's latest patents include an "Apparatus for dividing an adhesive film mounted on a wafer" and a "Wafer holding mechanism." The first patent describes a method for dividing an adhesive film on the back surface of a wafer, utilizing a cooling process and protective tape to ensure precise division along the streets formed on the wafer. The second patent outlines a wafer holding mechanism that employs suction force to securely hold a wafer affixed to a frame with tape, ensuring stability during processing.
Career Highlights
Naoki Ohmiya is currently employed at Disco Corporation, where he continues to develop innovative solutions in wafer technology. His work has significantly impacted the efficiency of wafer processing, making him a key figure in the industry.
Collaborations
Ohmiya collaborates with talented coworkers, including Yusuke Nagai and Yukio Morishige, who contribute to the advancement of technology in their field.
Conclusion
Naoki Ohmiya's contributions to wafer technology through his patents and work at Disco Corporation highlight his role as an influential inventor. His innovative approaches continue to shape the future of wafer processing.