The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2009

Filed:

Feb. 24, 2006
Applicants:

Naoki Ohmiya, Tokyo, JP;

Satoshi Genda, Tokyo, JP;

Noboru Takeda, Tokyo, JP;

Koichi Takeyama, Tokyo, JP;

Yukio Morishige, Tokyo, JP;

Hiroshi Morikazu, Tokyo, JP;

Hiroshi Nomura, Tokyo, JP;

Inventors:

Naoki Ohmiya, Tokyo, JP;

Satoshi Genda, Tokyo, JP;

Noboru Takeda, Tokyo, JP;

Koichi Takeyama, Tokyo, JP;

Yukio Morishige, Tokyo, JP;

Hiroshi Morikazu, Tokyo, JP;

Hiroshi Nomura, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/00 (2006.01); B24B 9/00 (2006.01); H01L 21/00 (2006.01); B25B 11/00 (2006.01); G03B 27/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.


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