Naohisa Nishioka

Title: Naohisa Nishioka: Innovator in Semiconductor Technology

Introduction: Naohisa Nishioka, a prominent inventor based in Tokyo, Japan, has made significant contributions to semiconductor technology. With an impressive portfolio of 30 patents, his work has paved the way for advancements in integrated circuits and chip stacking techniques.

Latest Patents: Among his recent innovations, Nishioka has developed a "TSV auto repair scheme on stacked die". This patent describes an apparatus featuring a first semiconductor chip with multiple pad electrodes and first latch circuits assigned to each pad. It includes a second semiconductor chip with various through-silicon vias (TSVs) connected to the pad electrodes and second latch circuits. A notable aspect of this invention is its training circuit, which detects defects in signal paths and stores fail signals for further analysis.

Another significant patent is the "Plurality of edge through-silicon vias and related systems, methods, and devices." This invention encompasses a stack of chips with a designated TSV zone where multiple TSVs are strategically placed at varying distances from the edges, enhancing the performance and reliability of electronic devices.

Career Highlights: Nishioka has held pivotal roles in esteemed companies such as Elpida Memory, Inc. and Micron Technology Incorporated. His expertise in semiconductor design and technology has been instrumental in driving innovations in these organizations.

Collaborations: Throughout his career, Nishioka has collaborated with notable professionals, including Chikara Kondo and Hideyuki Yoko. These partnerships have facilitated the development of advanced technologies that have transformed the semiconductor landscape.

Conclusion: Naohisa Nishioka is a distinguished inventor whose innovations have significantly impacted the field of semiconductor technology. With a robust portfolio of patents and a career rich in collaborations, he continues to contribute to the evolution of electronics, ensuring reliable and efficient solutions for the future.