Namiki Moriga

Title: Namiki Moriga: Innovator in Semiconductor Manufacturing

Introduction

Namiki Moriga is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 8 patents. His innovative approaches have paved the way for advancements in technology and manufacturing processes.

Latest Patents

One of Moriga's latest patents is a method of manufacturing a semiconductor device that includes an improved bump forming process. This process involves several key steps: a bump forming step where a bump is created on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step that slightly moves the capillary in an almost horizontal direction after the bump formation to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step that cuts the gold wire at the base portion after the sliding step. Notably, during the sliding step, the moving speed of the capillary is reduced compared to the bump forming step.

Career Highlights

Throughout his career, Moriga has worked with notable companies such as Mitsubishi Electric Corporation and Renesas Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Moriga has collaborated with esteemed colleagues, including Masahiko Ishikawa and Kohji Hayano. These partnerships have fostered a creative environment that has led to innovative solutions in the semiconductor industry.

Conclusion

Namiki Moriga's contributions to semiconductor manufacturing highlight his role as a key innovator in the field. His patents and collaborations reflect a commitment to advancing technology and improving manufacturing processes.