The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Dec. 17, 1993
Applicant:
Inventor:
Namiki Moriga, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257710 ; 257704 ;
Abstract
A plastic-molded hollow semiconductor device includes a base and a cover joined together by a thermosetting resin bonding material applied to the entire edge surfaces of the cover as well as bonding surfaces of the base and the cover. The thermosetting resin bonding material is applied after placing the cover on the base and simultaneously pre-heating them, whereby the gas trapped between the base and the cover is prevented from expanding, so that through-holes are eliminated, thereby making it possible to obtain a semiconductor device which provides a high level of handling property and reliability.