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For the Inventor, By the Inventor

Suwon-si, South Korea

Nam-Seog Kim

USPTO Granted Patents = 17

Average Co-Inventor Count = 3.5

ph-index = 7

Forward Citations = 170(Granted Patents)


Location History:

  • Chungcheongnam-do, KR (2004)
  • Suwon-si, KR (2006 - 2010)
  • Gyeonggi-do, KR (2007 - 2011)

Company Filing History:

goldMedal17 out of 131,744 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2004-2011

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17 patents (USPTO):Explore Patents
1. 7948089 - Chip stack package and method of fabricating the same (2011-05-24),
2. 7830017 - Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package (2010-11-09),
3. 7825710 - Delay-locked loop circuits and method for generating transmission core clock signals (2010-11-02),
4. 7777345 - Semiconductor device having through electrode and method of fabricating the same (2010-08-17),
5. 7697314 - Data line layout and line driving method in semiconductor memory device (2010-04-13),
6. 7656723 - Semiconductor memory device with hierarchical bit line structure (2010-02-02),
7. 7638365 - Stacked chip package and method for forming the same (2009-12-29),
8. 7616512 - Semiconductor memory device with hierarchical bit line structure (2009-11-10),
9. 7598607 - Semiconductor packages with enhanced joint reliability and methods of fabricating the same (2009-10-06),
10. 7551013 - Phase interpolation circuit and method of generating phase interpolation signal (2009-06-23),
11. 7489570 - Semiconductor memory device with hierarchical bit line structure (2009-02-10),
12. 7400177 - Amplifier circuit having constant output swing range and stable delay time (2008-07-15),
13. 7288966 - Programmable impedance controller and method for operating (2007-10-30),
14. 7214604 - Method of fabricating ultra thin flip-chip package (2007-05-08),
15. 7187214 - Amplifier circuit having constant output swing range and stable delay time (2007-03-06),

Title: The Innovative Contributions of Nam-Seog Kim

Introduction

Nam-Seog Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on enhancing the efficiency and functionality of chip packaging methods.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Chip stack package and method of fabricating the same." This innovation involves a chip stack package where semiconductor chips of varying die sizes are stacked by arranging pads in a scribe region through a redistribution process. This method effectively reduces the thickness of the package. Additionally, he has developed a "wafer level chip scale package," which applies a redistribution process at the wafer level. This package includes a semiconductor chip with a bonding pad and various insulating layers, enhancing the overall performance of semiconductor modules.

Career Highlights

Nam-Seog Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.

Collaborations

Throughout his career, Nam-Seog Kim has collaborated with notable colleagues, including Uk-Rae Cho and Hyun-Soo Chung. These partnerships have fostered a creative environment that has led to the development of advanced technologies in the semiconductor field.

Conclusion

Nam-Seog Kim's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the industry. His work continues to influence advancements in chip packaging methods, showcasing his role as a leading inventor in the field.

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