Company Filing History:
Years Active: 2004-2014
Title: Nakaatsu Yoshimura: Innovator in Resist Under Layer Film Technology
Introduction
Nakaatsu Yoshimura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of resist under layer films. With a total of 9 patents to his name, Yoshimura's work has advanced the technology used in various applications, including semiconductor manufacturing.
Latest Patents
Yoshimura's latest patents include a method for forming a resist under layer film and a pattern-forming method. The method for forming a resist under layer film involves providing a composition that includes a solvent and a calixarene compound or its derivative. This composition is processed under an oxidizing atmosphere with an oxygen content of 1% or more by volume to create a resist under layer film. The pattern-forming method utilizes a resist under layer film-forming composition that comprises an aminated fullerene with at least one amino group bonded to a fullerene skeleton, along with a solvent. This innovative composition demonstrates excellent etching resistance and high reproducibility in transferring resist patterns onto substrates.
Career Highlights
Yoshimura has established himself as a key figure in his field through his innovative research and development efforts. His work at JSR Corporation has positioned him at the forefront of advancements in resist technology. His contributions have not only enhanced the performance of resist under layer films but have also paved the way for new applications in the semiconductor industry.
Collaborations
Yoshimura has collaborated with notable colleagues, including Yousuke Konno and Hikaru Sugita. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas, further enhancing the impact of their collective work.
Conclusion
Nakaatsu Yoshimura's contributions to the field of resist under layer film technology are significant and impactful. His innovative patents and collaborative efforts continue to shape the future of materials science in the semiconductor industry.
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