This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: Naida Duranovic: Innovator in Electronic Assembly Technology
Introduction
Naida Duranovic is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of electronic device manufacturing. Her innovative work has led to the development of a unique patent that enhances the efficiency of electronic assembly processes.
Latest Patents
Naida holds a patent for a "Stretching retention plate for electronic assemblies." This invention describes a substrate retention plate system designed to hold a substrate during processing in electronic device manufacturing. The system features a top plate and a bottom plate that sandwich a flexible substrate. Notably, the top plate is equipped with several cams that stretch the flexible substrate across the bottom plate, ensuring optimal processing conditions.
Career Highlights
Naida Duranovic is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. Her role at Intel has allowed her to work on cutting-edge technologies that drive innovation in the electronics industry. With her expertise, she has contributed to the development of solutions that improve manufacturing efficiency and product quality.
Collaborations
Throughout her career, Naida has collaborated with talented individuals such as Daniel Chavez-Clemente and Joshua Heppner. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions in electronic assembly technology.
Conclusion
Naida Duranovic is a trailblazer in the field of electronic device manufacturing, with a patent that showcases her innovative spirit. Her work at Intel Corporation and collaborations with fellow professionals highlight her commitment to advancing technology in the industry. Naida's contributions are paving the way for future innovations in electronic assembly processes.
