This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2003-2004.
Company Filing History:
Years Active: 2003-2004
Title: Innovations by Murli Tirumala
Introduction
Murli Tirumala is an accomplished inventor based in Beaverton, OR (US). He has made significant contributions to the field of heat dissipation technology, holding 2 patents that showcase his innovative approach to thermal management in electronic devices.
Latest Patents
One of his latest patents is a manufacturing process for a radial fin heat sink. This invention involves a heat dissipation system and method for extracting heat from an integrated circuit device. It features a thermally conductive base with planar upper and lower surfaces, where the lower surface contacts the integrated circuit device. The design includes a conductive heat exchange portion with an array of fins that extends angularly from the base. This array houses an air movement device that creates swirling air movement, enhancing heat extraction from the heat exchange portion.
Another notable patent is for an integrated heat sink designed for different size components with EMI suppression features. This heat sink provides heat dissipation for multiple components mounted on a circuit board, each with varying height dimensions. It includes a first face with cooling fins and a second face with at least one pedestal that thermally couples to the components. The design ensures that the junction temperature at the contact area does not exceed the maximum design value. Additionally, it features a groove with a conductive gasket that forms a Faraday cage or EMI shield when attached to the circuit board.
Career Highlights
Murli Tirumala is currently employed at Intel Corporation, where he continues to innovate in the field of thermal management. His work has significantly impacted the efficiency and performance of electronic devices.
Collaborations
Throughout his career, Murli has collaborated with notable colleagues, including Lloyd L Pollard, II and Jim Noval. These collaborations have further enriched his contributions to the field.
Conclusion
Murli Tirumala's innovative patents and contributions to heat dissipation technology highlight his expertise and commitment to advancing electronic device performance. His work at Intel Corporation continues to influence the industry positively.