Intel Corporation

Murli Tirumala

Lloyd L Pollard, Ii

Scott L Noble

Steve J Lofland

Jim Noval

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive base having substantially planar upper and lower surfaces, the upper surface is disposed across from the lower surface, and the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends angularly away from the upper surface of the base. The array has a chamber within to house an air movement device so that the air introduced by the air movement device creates a swirling air movement over the heat exchange portion to increase air movement around the heat exchange portion to enhance the heat extraction from the heat exchange portion.

Manufacturing process for a radial fin heat sink

An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.

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Beaverton, OR, United States of America

Murli Tirumala