Tsuchiura, Japan

Muneo Kodaira

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Hitachi Cable, Inc.. Active years: 2006-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Muneo Kodaira. Retrieved from https://idiyas.com/inventor/muneo-kodaira

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2006-2008

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2 patents (USPTO):Explore Patents

Title: Muneo Kodaira: Innovator in Copper Foil Technology

Introduction

Muneo Kodaira is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of printed circuit board technology, particularly in the development of advanced copper foil solutions. With a total of 2 patents to his name, his work emphasizes both innovation and environmental conservation.

Latest Patents

Kodaira's latest patents include two key inventions. The first patent focuses on a copper foil for printed circuit boards, which comprises a roughened plating layer, a Ni-Co alloy plating layer, a zinc galvanized underlying layer, a chromate treatment layer, and a silane coupling treatment layer. This copper foil is designed to enhance the bonding with base materials for printed circuit boards. The chromate treatment layer is formed using a trivalent chromium conversion treatment solution that contains 70 mg/L or more and less than 500 mg/L of trivalent chromium ions, with a pH value of 3.0 to 4.5. This innovation allows for excellent controllability in the formation of zinc and chromate films.

The second patent addresses environmental concerns by introducing a rust-preventing layer formed through a trivalent chromium chemical conversion treatment on the surface of the copper foil. This layer contains 0.5 to 2.5 µg/cm² of chromium converted into metallic chromium, ensuring that the copper foil remains effective while being environmentally friendly.

Career Highlights

Muneo Kodaira is currently employed at Hitachi Cable, Inc., where he continues to develop innovative solutions in the field of copper foil technology. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and sustainable.

Collaborations

Kodaira has collaborated with several talented individuals in his field, including Yasuyuki Ito and Katsumi Nomura. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Muneo Kodaira's contributions to the field of printed circuit board technology through his innovative patents highlight his commitment to both performance and environmental sustainability. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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